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Mounting Pads
FEATURES
PRODUCT INFORMATION
MAXIMUM OPERATING TEMPERATURE
? Prevent heat damage during soldering
Suffix
Base material
Continuous Deflection Color
? Facilitate board clean-up
? Prevent solder bridges
NG
DAPG*
Nylon base resin
per ASTM STD
D4066-82-PA111
Diallyl Phthalate
121.0°C 250°F
204.4°C 400°F
243.3°C 470°F
282.2°C 540°F
Natural
Black only
? Assure uniform device height
per MIL-M-14G
type SDG
* All “DAP” mounting pads meet UL 94 V-0
Note: Please specify material for each mounting pad: “N” = nylon; “DAP” = Diallyl Phtalate.
Example: 7717-3NG, 7717-86DAPG
Index of Semiconductor Lead Conversion Pads
ORDERING INFORMATION
Converts lead
Part number
spacing from
To
# of Leads
Outside dia
Thickness
For epoxy transistors
7717-130G
0.05 In-Line
TO-92 & TO-15
3
5.84 (0.230)
1.02 (0.040)
For TO-18
7717-247G
7717-26G
7717-44G
TO-18
TO-18
TO-18
TO-5
TO-5
TO-5
3
3
4
7.11 (0.280)
8.71 (0.343)
7.75 (0.305)
3.81 (0.170)
3.05 (0.120)
3.18 (0.125)
See pages 108 and 109 for mechanical drawings
Index of Semiconductor Mounting Pads
ORDERING INFORMATION
Part number
Leads
Outside dia
Thickness
For TO-5
7717-86G
7717-178G
7717-79G
7717-3G
7717-15G
7717-5G
7717-4G
3
3
3
3–4
4
4
4
8.71 (0.343)
8.89 (0.350)
9.02 (0.355)
8.64 (0.340)
8.89 (0.350)
8.89 (0.350)
9.53 (0.375)
1.91 (0.075)
0 .53 (0.021)
0.97 (0.038)
1.91 (0.075)
0.51 (0.020)
3.18 (0.125)
1.91 (0.075)
For TO-18
7717-16G
7717-18G
7717-108G
7717-89G
7717-7G
4
4
4
4
4
5.08 (0.200)
5.08 (0.200)
5.16 (0.203)
6.35 (0.250)
6.35 (0.250)
0.51 (0.020)
2.54 (0.100)
1.78 (0.070)
2.03 (0.080)
3.18 (0.125)
For integrated circuits
7717-122G
7717-8G
7717-156G
8
8
14
9.27 (0.365)
9.53 (0.375)
19.05 x 11.43 (0.750 x 0.450)
1.78 (0.070)
1.91 (0.075)
1.27 (0.050)
Misc. mounting pads
7717-175G Crystal Can Relay
10.16 / 20.32 (0.400 x 0.800)
1.27 (0.050)
See pages 108 and 109 for mechanical drawings
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